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Furthermore, to obtain a fairly steady state evaporating liquid film is even more difficult than to measure the thickness and shapes of the meniscus. Accordingly, to measure the thickness and shapes of the meniscus requires that the experimental setup has the ability to measure the film thickness varies across several orders of magnitude. The film thickness of evaporating meniscus can range from nanometers in the case of equilibrium thin film to half of the microgroove width in the case of intrinsic meniscus and the film shape is closely associated with groove width, properties of substrate and working fluid, boundary conditions, etc. Consequently, the flow and heat transfer in the vicinity of the meniscus has been widely studied. Such high heat flux is extremely desirable for heat dissipation of microelectronic chips and other compact heat exchanger. m -2, the contribution of evaporating thin film to the overall heat transfer is more than 20% and can increase when the groove size is bigger or superheat is smaller ( Wang et al., 2007).
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In evaporating thin film, the heat flux peak can reach an order of magnitude of 10 6-10 7 W Heat and mass transfer characteristics of the evaporating meniscus is of key importance to heat pipes utilizing micro grooves and other heat exchangers based on interfacial phenomena.
HEAT FLUX EQUATION SOFTWARE
Journal of Software Engineering, 9: 735-748. Heat Flux Equation and Characteristics of Heat and Mass Transfer of Evaporating Meniscus. Guochang Zhao, Lei Cao, Liping Song and Tiandong Lu, 2015. For acceleration, Bond number is introduced to evaluate its influence on the heat transfer of evaporating meniscus. Other factors such as groove width, superheat, surface tension coefficient, latent heat of evaporation, kinetic viscosity and acceleration are analyzed as well. The disjoining pressure predominates in extremely thin films while the evaporation driving effect of temperature difference between the wall and vapor is dominant in relatively thicker films. The equation for evaporating heat flux is originally derived in thermal resistance form and it is found that the key factors that affect the heat transfer of intrinsic meniscus are surface tension and conduction thermal resistance of the liquid film the suppressing effects of disjoining pressure and surface tension are very strong. The governing equations for heat and mass transfer of evaporating meniscus are derived and solved by fourth-order Runge-Kutta method.